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Wafer Cleaning Machine - メーカー・企業9社の製品一覧とランキング

更新日: 集計期間:Oct 15, 2025~Nov 11, 2025
※当サイトの各ページの閲覧回数を元に算出したランキングです。

Wafer Cleaning Machineのメーカー・企業ランキング

更新日: 集計期間:Oct 15, 2025~Nov 11, 2025
※当サイトの各ページの閲覧回数を元に算出したランキングです。

  1. ゼビオス(XEVIOS CORP.,) Saitama//Industrial Machinery
  2. テクニカルフィット Saitama//Industrial Machinery
  3. LC 洗浄装置事業部 Tokyo//Electronic Components and Semiconductors
  4. 4 エイ・エス・エイ・ピイ Saitama//Electronic Components and Semiconductors
  5. 5 カイジョー ODM事業部 Tokyo//Industrial Electrical Equipment

Wafer Cleaning Machineの製品ランキング

更新日: 集計期間:Oct 15, 2025~Nov 11, 2025
※当サイトの各ページの閲覧回数を元に算出したランキングです。

  1. Wafer cleaning device "Double-sided scrub cleaning device (for research and development)" ゼビオス(XEVIOS CORP.,)
  2. Multi-slot wafer cleaning device LC 洗浄装置事業部
  3. Replacement from brush cleaning! Single-wafer cleaning device (scrubber) エイ・エス・エイ・ピイ
  4. 4 Example of a cleaning device for single-layer semiconductor wafers. カイジョー ODM事業部
  5. 4 Wafer cleaning device "Double-sided brush cleaning device (mass production type)" テクニカルフィット

Wafer Cleaning Machineの製品一覧

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Example of a cleaning device for single-layer semiconductor wafers.

Dual-sided cleaning device using a mega tube and spot-type shower for simultaneous surface and edge cleaning.

The mega tube and spot shower have been installed in the semiconductor wafer processing equipment. It is possible to install two vibrators in the narrow space within the chamber, allowing for simultaneous high-purity cleaning of the front and back surfaces as well as the edges. *You can check the video below.*

  • Ultrasonic Cleaner

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Example of a cleaning device for badge-type semiconductor wafers.

Semiconductor wafer cleaning device using QuoVar and HiMegaSonic

Indirect cleaning using quartz tanks for semiconductor wafers employs QuoVar and Hi-MegaSonic. In particular, Hi-MegaSonic has been highly regarded for its powerful cleaning capabilities and features, and has been used worldwide since its launch in 1986. Additionally, QuoVar is equipped with advanced damage reduction functionality.

  • Ultrasonic Cleaner

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Replacement from brush cleaning! Single-wafer cleaning device (scrubber)

A scrubber that employs a high-pressure jet with numerous proven results. When combined with a soft spray, it enables high-speed processing, high cleaning power, and low chemical consumption through sheet processing.

Our scrubber equipment utilizes a high-pressure jet with our unique special nozzles, achieving high-speed processing and high cleaning power through sheet processing, while also reducing the amount of chemical solution used. The nozzles can be selected from various methods, including high-pressure jet, two-fluid spray, and one-fluid spray, and combinations of these methods are also possible. We have a proven track record not only in wafer cleaning but also in photo mask cleaning. Additionally, there is no re-adhesion of particles, which is a common issue with DIP processing. The cleaning solution used is pure water, but organic solvents such as NMP can also be selected depending on the specifications. 【Features】 ■ High cleaning power with high-pressure jet method ■ Options for two-fluid and one-fluid spray nozzles! ■ Combinations of high-pressure jet with two-fluid and one-fluid sprays are also selectable ■ No particle re-adhesion *Please feel free to contact us for more details.

  • Other semiconductor manufacturing equipment

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Etching equipment, wafer cleaning equipment

【Demo unit available for loan!】A semi-automatic device that transports wafers from the processing tank to the rinse tank via an arc.

This machine is a semi-automatic device that manually attaches a basket with cassettes to a hanger, transports it in an arc from the processing tank to the rinsing tank, and processes wafers. For more details, please contact us.

  • Etching Equipment

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Cleaning device for solar cells, silicon wafer cleaning device.

Ideal for cleaning precision parts.

This is a cleaning line for silicon wafers used in solar cells. Because it is a completely custom-made product, we can respond to detailed needs. 【Features】 ○ Cleaning is divided into 'rough cleaning equipment' and 'finishing cleaning equipment.' (The photo shows the rough cleaning equipment) ○ One rough cleaning machine performs all processes: cleaning, jig separation, and rinsing. ○ One finishing cleaning machine performs all processes: cleaning, rinsing, and drying. ○ Precise transport that does not damage silicon wafers. ○ Both mineral-based cutting oil and water-soluble cutting oil can be custom-made. (Rough cleaning equipment) ○ Equipped with an automatic fire extinguishing system and can have an explosion-proof structure. ● For more details, please contact us.

  • シリコンウエハー洗浄機 画像1.jpg
  • Other cleaning machines

ブックマークに追加いたしました

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ブックマークを削除いたしました

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これ以上ブックマークできません

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Spin & conveyor processing equipment (etching, cleaning, stripping)

High-quality substrates can be provided with high throughput and low cost!

- Ideal for etching and cleaning processes. - Chemical treatment is done using a spin method, and rinse drying is done using a conveyor method. - Proven track record of high throughput support with W-lane configuration. - Measures against hazardous corrosive gases during etching: ◎ Equipped with front and rear shutters and rollers in the spin chamber. - Features temperature control circulation and reuse function for chemicals, as well as concentrated/diluted separation function for wastewater. - Swing spray function during rinsing can also be installed. - Up and down air knife drying designed to prevent reattachment of rinse water splashes. *For more details, please refer to the PDF document or feel free to contact us. Wafer, batch-type cleaning equipment, coating and developing equipment, substrate cleaning equipment, spin cleaning equipment, semiconductor manufacturing equipment, semiconductors, resist stripping equipment, megasonic, cleaning equipment, resist, photoresist, photolithography process, silicon, scrub cleaning equipment, scrub cleaning, wafer stripping equipment, wafer cleaning equipment, wafer cleaning machine.

  • Ultrasonic Cleaner

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Batch-type wafer cleaning equipment

Major renovations can also shorten the time required.

The unitization of the framework allows for significant modifications such as equipment configuration to be completed in a shorter time.

  • Other cleaning machines

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Wafer cleaning device "Double-sided brush cleaning device (mass production type)"

It is possible to transport, wash, and dry without touching the front and back surfaces of the work.

A single-wafer device that performs polishing slurry scrubbing with surfactants and pure water, rinsing with a megasonic spot shower, and spin drying. It allows for transport, cleaning, and drying without touching the front and back surfaces of the workpiece. Simultaneous edge scrubbing and cleaning is also performed. ■ Capable of simultaneous cleaning of both front and back sides ■ Target wafers for cleaning: silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ8”; thickness is negotiable ■ Also compatible with transparent wafers *For more details, please contact us or download and view the catalog.

  • Other cleaning machines

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これ以上ブックマークできません

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Multi-slot wafer cleaning device

Supports RCA cleaning and various etching! Significantly reduces the usage of chemicals and pure water as well as the footprint.

The product is a "multi-chamber wafer cleaning system" that offers both carrierless and carrier types. The carrierless type supports high-purity cleaning, significantly reducing the usage of chemicals and pure water, as well as the footprint. The carrier type allows for the selection of 1 or 2 cassettes for transporting a single batch. It is possible to configure the equipment for processes using acidic, alkaline, or organic chemical treatments. 【Features of the Multi-Chamber Carrierless System】 ■ Compatible with work sizes of 6-inch, 8-inch, and 12-inch wafers ■ Supports high-purity cleaning such as pre-coating cleaning through carrierless transport ■ Significantly reduces the usage of chemicals and pure water ■ Greatly minimizes the footprint ■ Drying options include IPA drying, warm water lift & IR drying, and Marangoni drying ■ Loaders and unloaders are compatible with cassettes or FOUPs *For more details, please download the PDF or feel free to contact us.

  • Other surface treatment equipment
  • Other semiconductor manufacturing equipment

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Wafer cleaning device "Double-sided scrub cleaning device (for research and development)"

It is possible to transport, wash, and dry without touching the front and back surfaces of the workpiece.

A single-wafer device that performs polishing slurry scrubbing with surfactants and pure water, rinsing with a megasonic spot shower, and spin drying. It allows for transport, cleaning, and drying without touching the front and back surfaces of the workpiece. Simultaneous edge scrubbing and cleaning is also performed. ■ Capable of simultaneous cleaning of both front and back sides ■ Target wafers for cleaning: silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ8”; thickness is negotiable ■ Also compatible with transparent wafers *For more details, please contact us or download the catalog for more information.

  • Other cleaning machines

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

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Wafer cleaning device "Double-sided brush cleaning device (mass production type)"

It is possible to transport, wash, and dry without touching the front and back surfaces of the workpiece.

A single-wafer device that performs polishing slurry scrubbing with surfactants and pure water, rinsing with a megasonic spot shower, and spin drying. It allows for transport, cleaning, and drying without touching the front and back surfaces of the workpiece. Simultaneously, edge scrubbing and cleaning are also performed. ■ Capable of simultaneous cleaning of both front and back sides ■ Target wafers for cleaning: silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ8”, thickness to be discussed ■ Also compatible with transparent wafers *For more details, please contact us or download the catalog for review.

  • Other cleaning machines
  • Ultrasonic Cleaner
  • Other semiconductor manufacturing equipment

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録

Wafer cleaning device "Double-sided scrub cleaning device (for research and development)"

It is possible to transport, wash, and dry without touching the front and back surfaces of the work.

A single-wafer device that performs polishing slurry scrubbing with surfactants and pure water, rinsing with megasonic spot shower, and spin drying. It allows for transport, cleaning, and drying without touching the front and back surfaces of the workpiece. Simultaneous edge scrubbing and cleaning is also performed. ■ Capable of simultaneous cleaning of both front and back sides ■ Wafer types to be cleaned: Silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ8”, thickness to be discussed ■ Also compatible with transparent wafers *For more details, please contact us or download the catalog for more information.

  • Other cleaning machines
  • Ultrasonic Cleaner
  • Other semiconductor manufacturing equipment

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録

Wafer cleaning device "Double-sided brush cleaning device (for research and development)"

It is possible to transport, wash, and dry without touching the front and back surfaces of the work.

A single-wafer device that performs polishing slurry scrubbing with surfactants and pure water, rinsing with a megasonic spot shower, and spin drying. It allows for transportation, cleaning, and drying without touching the front and back surfaces of the workpiece. Simultaneous edge scrubbing and cleaning is also performed. ■ Capable of simultaneous cleaning of both sides ■ Target wafers for cleaning: silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ8”, thickness to be discussed ■ Also compatible with transparent wafers *For more details, please contact us or download the catalog for more information.

  • Other cleaning machines
  • Ultrasonic Cleaner
  • Other semiconductor manufacturing equipment

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録

Wafer cleaning device "Double-sided brush cleaning device (for research and development)"

It is possible to transport, wash, and dry without touching the front and back surfaces of the work.

A single-wafer device that performs polishing slurry cleaning with surfactants and pure water, rinsing with a megasonic spot shower, and spin drying. It allows for transport, cleaning, and drying without touching the front and back surfaces of the workpiece. Simultaneous edge scrubbing is also performed. ■ Capable of simultaneous cleaning of both sides ■ Target wafers for cleaning: silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ8”; thickness is negotiable ■ Also compatible with transparent wafers *For more details, please contact us or download the catalog for review.

  • Other cleaning machines

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録